Stay ahead of the semiconductor technology curve
As technology rapidly advances, and consumers demand more customization, 鼎博体育 has taken the next step forward in packaging with the development of new technologies to enhance, and sometimes drastically change, the packaging arena.
With one of the strongest R&D teams in the industry and over 300 leading semiconductor packaging technologists, 鼎博体育 is focused on design and development efforts to further advance the value of packaging and provide the total solution for our customers.
We have been instrumental in the development of almost every new packaging technology advance, including thin package formats and BGA packages. 鼎博体育 is now focusing on developing technology such as Through Silicon Via (TSV), Through Mold Via (TMV®), System in Package (SiP), copper wirebond, copper pillar, and improving interconnect with flip chip technology and 3D solutions like stacked die packages. We also have teams focused on the latest industry developments including packaging options for the emerging markets of photonics, MEMS, optical sensors, wafer-level packaging and Antenna in Package/Antenna on Package.
Solutions for high performance and functionality
Volumetric packaging solutions for higher integration and performance
Cutting-edge solutions for 5G applications
Make complex simple
The interconnect advantage
Improve the robustness of your package design
Packaging solutions to meet various package needs
Wire bond alternatives
Breakthrough with high-end micro-packaging solutions
Enhance reliable and fast sensing applications
Package solutions for a variety of challenges
Increase integration with a reduced footprint
Ideal solution for low cost integration at a smaller size