Low-profile leadframe packaging
鼎博体育’s Thin Small Outline Package (TSOP) is a leadframe-based, plastic encapsulated package suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. 鼎博体育 has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost.
- Cu or Ag wire interconnect for low cost
- Standard JEDEC package outlines
- Enhanced design for memory applications
- Stacked die up to 4X, including stair step and Film-over Wire (FoW) construction
- Turnkey test services, including strip test options